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ProMOS 12” Fab III Ground Breaking Ceremony
Client: ProMOS Technologies
Category: Other Events
Time: Apr. 8, 2004
Venue: Central Taiwan Science Park
Description:

In the new semiconductor era where 12” wafer and nano-technology dominate, ProMOS Technologies is going to invest US$3.2 billion over a five-year period to construct a state-of-the-art 12” fab in the Central Taiwan Science Park (CTSP) to produce the next generation memory chips.

The ground breaking ceremony was planned by Era Public Relations and the scale was over 550 people. VIPs from the government gave their speeches to endorse ProMOS’ contribution to Taiwan’s high-tech industry, including Shyi-kun Yu, Premier of Executive Yuan, Yi-Fu Lin, Minister of Ministry of Economic Affairs, Che-Ho Wei, Minister of National Science Council, Chung-Sheng Huang, Commissioner of Taichung County and Jason Hu, Mayor of Taichung City.

Over 60 clippings including 8 TV exposures were collected following the event.